Led chip package structure with an embedded esd function and method for manufacturing the same

ABSTRACT

An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an LED chip package structure and amethod for manufacturing the same, and particularly relates to an LEDchip package structure with an embedded ESD (Electro-Static Discharge)function and a method for manufacturing the same.

2. Description of Related Art

Referring to FIG. 1, the prior art provides an LED chip packagestructure including: a substrate structure 1, at least one LED(light-emitting diode) 2 disposed on the substrate structure 1, an ESDdevice 3, and a fluorescent body 4.

The LED 2 has a positive electrode 21 and a negative electrode 22respectively electrically connected to a positive electrode 11 and anegative electrode 12 of the substrate structure 1 via two lead wiresW1. The ESD device 3 is disposed on the substrate structure 1. Thenegative electrode 32 of the ESD device 3 is directly electricallyconnected to the positive electrode 11 of the substrate structure 1, andthe positive electrode 31 of the ESD device 3 is electrically connectedto the negative electrode 12 of the substrate structure 1 via a leadwire W2. In addition, the fluorescent body 4 covers the LED 2 and theESD device 3 in order to protect the LED 2 and the ESD device 3.

However, the LED chip package structure of the prior art has thefollowing defects:

1. Because the position of the LED 2 is over low, the light-emittingefficiency of the LED 2 cannot be increased effectively.

2. Because the ESD device 3 is disposed close to the LED 2, thelight-emitting efficiency of the LED 2 is affected by the ESD device 3.

3. Because the LED 2 and the ESD device 3 are disposed on the sameconductive pin of the substrate structure 1, the heat-dissipatingefficiency of the LED 2 is affected by the ESD device 3.

SUMMARY OF THE INVENTION

One particular aspect of the present invention is to provide an LED chippackage structure with an embedded ESD function and a method formanufacturing the same. The present invention makes an ESD unit and alight-emitting unit separated from each other and respectively disposedon two different layers, so that the light-emitting unit does not beaffected by the ESD unit.

Moreover, because a fluorescent layer does not contact with thelight-emitting unit, the present invention can prevent thelight-emitting efficiency of the fluorescent layer from being decreaseddue to the high temperature generated by the light-emitting unit.

Furthermore, the LED chip package structure can be applied to any typeof light source such as a back light module, a decorative lamp, alighting lamp, or a scanner.

In order to achieve the above-mentioned aspects, the present inventionprovides an LED chip package structure with an embedded ESD(Electro-Static Discharge) function, including: a conductive unit, afirst package unit, an ESD unit, a second package unit, a light-emittingunit and a second package unit. The conductive unit has at least twoconductive pins adjacent to each other which form a concave spacebetween each other. The first package unit encloses one part of eachconductive pin in order to form a receiving space that communicates withthe concave space and to expose an end side of each conductive pin. TheESD unit is received in the concave space and electrically connectedbetween the two conductive pins. The second package unit is received inthe concave space in order to cover the ESD unit. The light-emittingunit is received in the receiving space and electrically connectedbetween the two conductive pins. The third package unit is received inthe receiving space in order to cover the light-emitting unit.

In order to achieve the above-mentioned aspects, the present inventionprovides a method for manufacturing an LED chip package structure withan embedded ESD (Electro-Static Discharge) function, including:providing a conductive unit that has at least two conductive pinsadjacent to each other which form a concave space between each other;enclosing one part of each conductive pin by a first package unit inorder to form a receiving space that communicates with the concave spaceand to expose an end side of each conductive pin; receiving an ESD unitin the concave space and electrically connecting the ESD unit betweenthe two conductive pins; receiving a second package unit in the concavespace in order to cover the ESD unit; receiving a light-emitting unit inthe receiving space and electrically connecting the light-emitting unitbetween the two conductive pins; and receiving a third package unit inthe receiving space in order to cover the light-emitting unit.

Moreover, the third package unit has following four choices according todifferent requirements:

The first embodiment: The third package unit is made of a transparentmaterial.

The second embodiment: The third package unit is made of a fluorescentmaterial, and the fluorescent material is formed by mixing silicone andfluorescent powders or mixing epoxy and fluorescent powders.

The third embodiment: The third package unit has a transparent layercovering the light-emitting unit and a fluorescent layer formed on thetransparent layer.

The fourth embodiment: The third package unit has fluorescent layercovering the light-emitting unit and a transparent layer formed on thefluorescent layer.

Hence, the present invention has the following advantages:

1. The light-emitting unit is positioned at a higher position by thesupport of the second package unit. Hence, the light-emitting efficiencyof the light-emitting unit can be increased.

2. The ESD unit and the light-emitting unit are separated from eachother and are respectively disposed on two different layers, so that thelight-emitting efficiency of the light-emitting unit does not beaffected by the ESD unit.

3. The ESD unit and the light-emitting unit are separated from eachother and are respectively disposed on two different layers, so that theheat-dissipating efficiency of the light-emitting unit does not beaffected by the ESD unit.

4. Because the fluorescent layer does not contact with thelight-emitting unit, the present invention can prevent thelight-emitting efficiency of the fluorescent layer from being decreaseddue to the high temperature generated by the light-emitting unit.

5. The quantity of the fluorescent layer can be decreased by using thetransparent layer, and the transparent layer can prevent the fluorescentlayer from being damaged by external force.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, and are intended toprovide further explanation of the invention as claimed. Otheradvantages and features of the invention will be apparent from thefollowing description, drawings and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The various objects and advantages of the present invention will be morereadily understood from the following detailed description when read inconjunction with the appended drawings, in which:

FIG. 1 is a lateral, schematic view of an LED chip package structurewith an embedded ESD function of the prior art;

FIG. 2 is a flowchart of a method for manufacturing an LED chip packagestructure with an embedded ESD function according to the firstembodiment of the present invention;

FIGS. 2A to 2E are cross-sectional views of an LED chip packagestructure with an embedded ESD function according to the firstembodiment of the present invention, at different stages of thepackaging processes, respectively;

FIG. 3 is a cross-sectional view of an LED chip package structure withan embedded ESD function according to the second embodiment of thepresent invention;

FIG. 4 is a cross-sectional view of an LED chip package structure withan embedded ESD function according to the third embodiment of thepresent invention;

FIG. 5 is a cross-sectional view of an LED chip package structure withan embedded ESD function according to the fourth embodiment of thepresent invention; and

FIG. 6 is a cross-sectional view of an LED chip package structure withan embedded ESD function according to the fifth embodiment of thepresent invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring to FIGS. 2, and 2A to 2E, the first embodiment of the presentinvention provides a method for manufacturing an LED chip packagestructure with an embedded ESD (Electro-Static Discharge) function. Themethod includes the following steps:

The step S100 is: referring to FIGS. 2 and 2A, providing a conductiveunit 1 a that has at least two conductive pins 10 a adjacent to eachother which form a concave space 100 a between each other. In addition,each conductive pin 10 a has an extending portion 101 a and a bendingportion 102 a bent downwards from the extending portion 101 a, and theconcave space 100 a is formed between the two bending portions 102 athat are adjacent to each other.

The step S102 is: referring to FIGS. 2 and 2A, enclosing one part ofeach conductive pin 10 a by a first package unit 2 a in order to form areceiving space 200 a that communicates with the concave space 100 a andto expose an end side of each conductive pin 10 a. In other words, oneside of each extending portion 101 a is extended beyond the firstpackage unit 2 a, and the first package unit 2 a can be made of anopaque material.

The step S104 is: referring to FIGS. 2 and 2B, receiving an ESD unit 3 ain the concave space 100 a and electrically connecting the ESD unit 3 abetween the two conductive pins 10 a. In the first embodiment, the ESDunit 3 a is electrically disposed on one of the two conductive pins 10 aand is electrically connected to the other conductive pin 10 a via alead wire W1 a.

The step S106 is: referring to FIGS. 2 and 2C, receiving a secondpackage unit 4 a in the concave space 100 a in order to cover the ESDunit 3 a. In addition, the second package unit 4 a can be made of apackage material with light-reflecting substance, such as highreflection substance or total reflection substance.

The step S108 is: referring to FIGS. 2 and 2D, receiving alight-emitting unit 5 a in the receiving space 200 a and electricallyconnecting the light-emitting unit 5 a between the two conductive pins10 a. In addition, the light-emitting unit 5 a can be an LED(light-emitting diode). The light-emitting unit 5 a is electricallydisposed on the second package unit 4 a, and the light-emitting unit 5 ais electrically connected to the two conductive pins 10 a via two leadwires W2 a. The light-emitting unit 5 a can generate high reflectiveeffect by the high reflection property of the second package unit 4 a.Moreover, the light-emitting unit 5 a can be positioned at a higherposition by the support of the second package unit 4 a. Hence, thelight-emitting efficiency of the light-emitting unit 5 a can beincreased. Furthermore, the ESD unit 3 a and the light-emitting unit 5 aare separated from each other and are respectively disposed on twodifferent layers, so that the light-emitting efficiency and theheat-dissipating efficiency of the light-emitting unit 5 a do not beaffected by the ESD unit 3 a.

The step S110 is: referring to FIGS. 2 and 2E, receiving a third packageunit 6 a in the receiving space 200 a in order to cover thelight-emitting unit 5 a. In the first embodiment, the third package unit6 a is made of a transparent material.

Referring to FIG. 2E, the first embodiment provides an LED chip packagestructure with an embedded ESD (Electro-Static Discharge) function,including: a conductive unit 1 a, a first package unit 2 a, an ESD unit3 a, a second package unit 4 a, a light-emitting unit 5 a and a secondpackage unit 6 a. The conductive unit 1 a has at least two conductivepins 10 a adjacent to each other which form a concave space 100 abetween each other. The first package unit 2 a encloses one part of eachconductive pin 10 a in order to form a receiving space 200 a thatcommunicates with the concave space 100 a and to expose an end side ofeach conductive pin 10 a. The ESD unit 3 a is received in the concavespace 100 a and electrically connected between the two conductive pins10 a. The second package unit 4 a is received in the concave space 100 ain order to cover the ESD unit 3 a. The light-emitting unit 5 a isreceived in the receiving space 200 a and electrically connected betweenthe two conductive pins 10 a. The third package unit 6 a is received inthe receiving space 200 a in order to cover the light-emitting unit 5 a.

Referring to FIG. 3, the second embodiment provides an LED chip packagestructure with an embedded ESD (Electro-Static Discharge) function,including: a conductive unit 1 b, a first package unit 2 b, an ESD unit3 b, a second package unit 4 b, a light-emitting unit 5 b and a secondpackage unit 6 b. The difference between the second embodiment and thefirst embodiment is that: in the second embodiment, the ESD unit 3 b iselectrically disposed on the first package unit 2 b, so that the ESDunit 3 b is electrically connected to two conductive pins 10 a of theconductive unit 1 b via two lead wires W1 b. In addition, thelight-emitting unit 5 b is electrically disposed on one of the twoconductive pins 10 b via a lead wire W2 b and is electrically connectedto the other conductive pin 10 b via another lead wire W2 b.

Referring to FIG. 4, the difference between the third embodiment and thefirst embodiment is that: in the third embodiment, a third package unit6 c is made of a fluorescent material, and the fluorescent material canbe formed by mixing silicone and fluorescent powders or mixing epoxy andfluorescent powders.

Referring to FIG. 5, the difference between the fourth embodiment andthe first embodiment is that: in the fourth embodiment, a third packageunit 6 d has a transparent layer 60 d covering a light-emitting unit 5 dand a fluorescent layer 61 d formed on the transparent layer 60 d.Hence, the third package unit 6 d is composed of the transparent layer60 d and the fluorescent layer 61 d. Because the fluorescent layer 61 ddoes not contact with the light-emitting unit 5 d, the present inventioncan prevent the light-emitting efficiency of the fluorescent layer 61 dfrom being decreased due to the high temperature generated by thelight-emitting unit 5 d.

Referring to FIG. 6, the difference between the fifth embodiment and thefirst embodiment is that: in the fifth embodiment, a third package unit6 e has fluorescent layer 61 e covering a light-emitting unit 5 e and atransparent layer 60 e formed on the fluorescent layer 61 e. Inaddition, the quantity of the fluorescent layer 61 e can be decreased byusing the transparent layer 60 e, and the transparent layer 60 e canprevent the fluorescent layer 61 e from being damaged by external force.

In conclusion, the present invention makes the ESD unit and thelight-emitting unit separated from each other and respectively disposedon two different layers, so that the present invention has the followingadvantages:

1. The light-emitting unit is positioned at a higher position by thesupport of the second package unit. Hence, the light-emitting efficiencyof the light-emitting unit can be increased.

2. The ESD unit and the light-emitting unit are separated from eachother and are respectively disposed on two different layers, so that thelight-emitting efficiency of the light-emitting unit does not beaffected by the ESD unit.

3. The ESD unit and the light-emitting unit are separated from eachother and are respectively disposed on two different layers, so that theheat-dissipating efficiency of the light-emitting unit does not beaffected by the ESD unit.

4. Because the fluorescent layer 61 d does not contact with thelight-emitting unit 5 d, the present invention can prevent thelight-emitting efficiency of the fluorescent layer 61 d from beingdecreased due to the high temperature generated by the light-emittingunit 5 d.

5. The quantity of the fluorescent layer 61 e can be decreased by usingthe transparent layer 60 e, and the transparent layer 60 e can preventthe fluorescent layer 61 e from being damaged by external force.

Although the present invention has been described with reference to thepreferred best molds thereof, it will be understood that the inventionis not limited to the details thereof. Various substitutions andmodifications have been suggested in the foregoing description, andothers will occur to those of ordinary skill in the art. Therefore, allsuch substitutions and modifications are intended to be embraced withinthe scope of the invention as defined in the appended claims.

1. An LED chip package structure with an embedded ESD (Electro-StaticDischarge) function, comprising: a conductive unit having at least twoconductive pins adjacent to each other which form a concave spacebetween each other; a first package unit enclosing one part of eachconductive pin in order to form a receiving space that communicates withthe concave space and to expose an end side of each conductive pin; anESD unit received in the concave space and electrically connectedbetween the two conductive pins; a second package unit received in theconcave space in order to cover the ESD unit; a light-emitting unitreceived in the receiving space and electrically connected between thetwo conductive pins; and a third package unit received in the receivingspace in order to cover the light-emitting unit.
 2. The LED chip packagestructure as claimed in claim 1, wherein each conductive pin has anextending portion and a bending portion bent downwards from theextending portion, one side of the extending portion is extended beyondthe first package unit, and the concave space is formed between the twobending portions that are adjacent to each other.
 3. The LED chippackage structure as claimed in claim 1, wherein the ESD unit iselectrically disposed on one of the two conductive pins.
 4. The LED chippackage structure as claimed in claim 1, wherein the ESD unit iselectrically disposed on the first package unit.
 5. The LED chip packagestructure as claimed in claim 1, wherein the light-emitting unit iselectrically disposed on one of the two conductive pins.
 6. The LED chippackage structure as claimed in claim 1, wherein the light-emitting unitis electrically disposed on the second package unit.
 7. The LED chippackage structure as claimed in claim 1, wherein the first package unitis made of an opaque material, and the second package unit is made of apackage material with light-reflecting substance.
 8. The LED chippackage structure as claimed in claim 1, wherein the third package unitis made of a transparent material or a fluorescent material, and thefluorescent material is formed by mixing silicone and fluorescentpowders or mixing epoxy and fluorescent powders.
 9. The LED chip packagestructure as claimed in claim 1, wherein the third package unit has atransparent layer covering the light-emitting unit and a fluorescentlayer formed on the transparent layer.
 10. The LED chip packagestructure as claimed in claim 1, wherein the third package unit hasfluorescent layer covering the light-emitting unit and a transparentlayer formed on the fluorescent layer.
 11. A method for manufacturing anLED chip package structure with an embedded ESD (Electro-StaticDischarge) function, comprising: providing a conductive unit that has atleast two conductive pins adjacent to each other which form a concavespace between each other; enclosing one part of each conductive pin by afirst package unit in order to form a receiving space that communicateswith the concave space and to expose an end side of each conductive pin;receiving an ESD unit in the concave space and electrically connectingthe ESD unit between the two conductive pins; receiving a second packageunit in the concave space in order to cover the ESD unit; receiving alight-emitting unit in the receiving space and electrically connectingthe light-emitting unit between the two conductive pins; and receiving athird package unit in the receiving space in order to cover thelight-emitting unit.
 12. The method as claimed in claim 11, wherein eachconductive pin has an extending portion and a bending portion bentdownwards from the extending portion, one side of the extending portionis extended beyond the first package unit, and the concave space isformed between the two bending portions that are adjacent to each other.13. The method as claimed in claim 11, wherein the ESD unit iselectrically disposed on one of the two conductive pins.
 14. The methodas claimed in claim 11, wherein the ESD unit is electrically disposed onthe first package unit.
 15. The method as claimed in claim 11, whereinthe light-emitting unit is electrically disposed on one of the twoconductive pins.
 16. The method as claimed in claim 11, wherein thelight-emitting unit is electrically disposed on the second package unit.17. The method as claimed in claim 11, wherein the first package unit ismade of an opaque material, and the second package unit is made of apackage material with light-reflecting substance.
 18. The method asclaimed in claim 11, wherein the third package unit is made of atransparent material or a fluorescent material, and the fluorescentmaterial is formed by mixing silicone and fluorescent powders or mixingepoxy and fluorescent powders.
 19. The method as claimed in claim 11,wherein the third package unit has a transparent layer covering thelight-emitting unit and a fluorescent layer formed on the transparentlayer.
 20. The method as claimed in claim 11, wherein the third packageunit has fluorescent layer covering the light-emitting unit and atransparent layer formed on the fluorescent layer.